Novel high capacity model for copper binary ion exchange on e-waste derived adsorbent resin

Abstract Heavy metal water pollution is a global concern in recent years. Copper toxic at higher concentrations (> 20 μg /g) and needs to be removed using ion exchanger systems. This study investigates the removal efficiencies of copper by non-metallic fraction (NMF) waste printed circuit boards (PCBs). The high maximum adsorption capacity PCB-derived material after activation with KOH was 2.65 mmol/g, experimental isotherm best correlated Temkin model. Finally, this presents novel dual site adsorption/ion exchange mechanism, wherein potassium (from activation) calcium (present structure) served as sites for solution. Therefore, recycling study, focusing on cyclic environmental management, converts major an activated resin (high capacity) from wastewater solutions successfully regenerates re-use while producing acidic solution recovery electrolysius or chemical salt precipitation.